What to Include in a TFT LCD Module RFQ
A useful TFT LCD module RFQ connects the display to the device. Specify the application, geometry, host interface, optical and touch needs, environment, quantities and schedule. Attach available drawings or datasheets, and mark unknown fields as open items.
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Copy-ready LCD module RFQ template
Copy this table into your project brief. Distinguish fixed requirements from preferences so a supplier can identify an existing module, a modified assembly or a custom development route. Example interface and technology names below are options, not a recommended configuration.
| RFQ field | Your requirement |
|---|---|
| Application and project stage | Device, use environment; concept, prototype, EVT, DVT, PVT, production or replacement. |
| Size and resolution | Diagonal in inches; pixel resolution; landscape or portrait orientation. |
| Mechanical limits | Outline width × height × thickness, active/view area, mounting and connector clearances. |
| Viewing technology | TN, IPS, VA or open to recommendation; intended viewing direction. |
| Display interface and host | SPI, MCU, RGB, LVDS, MIPI DSI or open; processor part number and OS/firmware environment. |
| Timing and initialization | Color depth, refresh target, host-supported timing, reset and initialization information. |
| Brightness and viewing conditions | Target in cd/m² or nits; indoor/outdoor use, ambient light and viewing angle. |
| Backlight and power | Voltage/current, dimming method, power budget, lifetime target and available heat path. |
| Touch | None, resistive or capacitive; controller/interface; glove, water, stylus or multitouch needs. |
| Cover lens and bonding | Thickness, shape, printing, openings and surface treatment; air gap, optical bonding or open. |
| Connector and FPC | Connector identity, pitch, pin assignment, contact side, FPC exit direction, length and bend path. |
| Electrical requirements | Logic and I/O rails, backlight supply, current limits and LCD/backlight/reset/touch sequencing. |
| Environment and qualification | Operating/storage temperature ranges, humidity and exposure; required tests and acceptance criteria. |
| Documentation and compliance | Required specifications, drawings, reports, material declarations and applicable project requirements. |
| Quantity, lifecycle and budget | Sample/pilot quantities, annual forecast, production lifetime, change-notice needs and tooling/NRE budget. |
| Schedule and attachments | Sample deadline, production target and supplied file names with revision identifiers. |
If a value is unknown, write “open to supplier recommendation” and state the constraint it must satisfy. For example, an interface can remain open if the host processor has not been selected; a fixed enclosure still needs a defined mechanical limit.
Add the application context
Explain what the operator sees and does: viewing distance, indoor or outdoor operation, glove or wet-touch use, duty cycle and cleaning or chemical exposure. These details can change the optical stack, touch tuning, thermal review and qualification plan.
For an industrial HMI, identify the enclosure and operating conditions. For an automotive HUD or PGU, add optical-path assumptions, virtual-image targets, brightness losses and heat limits. A replacement project should identify the old module and the changes the host system can tolerate.
Identify the constraints that can stop a design
Mechanical fit: diagonal size does not define the outline, active area or FPC position. Attach the enclosure drawing when the housing is fixed. Compare a documented 7-inch 1024×600 module example by its actual configuration, then state the differences your device requires.
Host compatibility: give the processor model and available display outputs. For MIPI DSI, confirm lane configuration and initialization support; for any interface, verify timing, voltage, connector pinout and software support. Use the MIPI, LVDS and RGB comparison for an initial shortlist and the detailed interface guide for the engineering checks.
Optical stack: brightness alone does not establish sunlight readability. State ambient light, cover-lens treatment, bonding construction and the available power and thermal budget. Include touch and cover glass in the initial request so the quotation covers the intended assembly.
Qualification: describe the actual enclosure, airflow, ambient temperature and required environmental or electrical tests. Supply test conditions and pass limits when available. List RoHS, REACH or other documentation requirements explicitly; a requested certificate or test is not evidence that a module already meets it.
Separate operating temperature from storage temperature. Identify relevant humidity, condensation, salt mist, UV or chemical exposure rather than requesting a generic “industrial-grade” display. If the test plan includes thermal shock, damp heat, vibration, ESD, drop or UV aging, attach the project’s conditions and acceptance rules so the supplier can review the same requirement.
Supply continuity: distinguish a sample deadline from the expected production lifetime. State change-notice, alternate-panel, inspection, labeling, packaging and lot-traceability needs before the commercial review.
Attach files that resolve the open questions
- Existing module: current datasheet, part number and relevant photos, especially for replacement or failure review.
- Mechanical assembly: enclosure/front-cover drawing, connector details and FPC route or clearance sketch.
- Host electronics: processor/interface information, relevant schematic section and available timing or initialization data.
- Optics and validation: cover-lens requirements, target viewing conditions, reliability plan and acceptance criteria.
Label each file with its part or project reference and revision. Send the evidence you already have and list missing items separately. Avoid presenting an unconfirmed value as a fixed specification merely to complete the form.
For a field issue, describe when the symptom occurs and include the current installation conditions. A photograph identifies the symptom; the host, connector and enclosure information helps establish what needs investigation.
Technical background for a more specific brief
Review standard TFT LCD modules before requesting changes through custom TFT engineering. For manufacturing terminology, see module assembly, the TFT-LCD array process and array materials. These guides provide context; the selected module’s controlled specification remains the basis for compatibility review.
Send your LCD project brief
Send the completed fields and available evidence to sales@successlcd.com, with your company and project reference. Identify the open questions so the review can establish the next practical step.
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